What is small outline?

Small Outline (SO) is a type of electronic component packaging standard for surface mount integrated circuits (ICs). It is one of the smallest package formats available for microchips and is commonly used for high-density devices in modern electronics.

The SO package has a small rectangular body with a low profile, making it suitable for tight spaces, including mobile devices, computer components, and other space-constrained applications. It is available in various sizes, such as SO-8, SO-14, SO-16, and SO-20, with the number indicating the number of pins available.

A key advantage of the SO package is its high thermal performance due to its small size. It allows for efficient heat dissipation, making it well-suited for power devices. Additionally, it can offer good electrical performance, with reliable signal integrity and low electromagnetic interference.

In conclusion, small outline packaging is an essential component in modern electronics, delivering high thermal performance and signal integrity in a small form factor. It is commonly used in various electronic devices, including mobile phones, laptops, and other compact devices.